1. Platform Documentation
Android 13 BSP, Linux kernel drivers and flashing tool — supplied with the module package after purchase.
2. Introduction
The Unisoc UIS7885 (P7885) 5G AI core board is an industrial system-on-module built on Unisoc's 6nm EUV platform: octa-core CPU (1× Cortex-A76 @2.7 GHz + 3× Cortex-A76 @2.3 GHz + 4× Cortex-A55 @2.1 GHz), an 8 TOPS NPU with a VQ7 @1 GHz VDSP, a 4-core GPU @850 MHz, 4K@60 fps hardware codec, 108MP ISP, and an integrated 5G Sub-6 GHz modem supporting 2CC and SUL. The module exposes PCIe 3.0, USB 3.1 Gen2, 2× MIPI DSI and 4× MIPI CSI, targeting edge AI, digital signage, 5G gateways and mobile robotics. Android 13 BSP and Linux are supported, and the SoC integrates an iSE financial-grade security engine with SCA Level-2 certification.
3. Features
- High-Efficiency 6nm EUV Architecture: Powered by Unisoc UIS7885 with 1× Cortex-A76 @ 2.7GHz + 3× Cortex-A76 @ 2.3GHz + 4× Cortex-A55 @ 2.1GHz octa-core CPU for intensive multi-threaded workloads.
- Integrated 8 TOPS AI NPU: High-throughput neural processing unit supporting real-time edge computer vision, facial recognition, object detection, and lightweight LLM inference.
- 5G Sub-6 GHz with 2CC / SUL: 3GPP R15, NSA/SA, LTE DL Cat15 + UL Cat18, dual-SIM dual-standby. Supported NR band list is module-specific — confirm against the datasheet before ordering.
- 4K Multi-Display & Quad Camera ISP: Supports DisplayPort 1.4 (4K @ 60fps) over Type-C, dual 4-lane MIPI DSI, and quad MIPI CSI camera inputs with up to 108MP image signal processing.
- High-Speed Expansion: PCIe 3.0 ×1 for NVMe SSD, USB 3.1 Gen2 (10 Gbps) Type-C, SDIO 3.0, plus UART / I2C / SPI / I2S. Interfaces actually routed to the LGA connector are listed in the module datasheet — the SoC exposes more than the connector.
- Compact LGA Module: 42.5 × 56.5 mm LGA form factor. Height, weight and operating-temperature range follow the module datasheet — confirm the −35 °C ~ +75 °C rating with the supplier before committing to an industrial deployment.
4. Shipping List
- Standard Core Board Package: 1× Jieyuan Unisoc UIS7885 5G AI Core Board (Selected RAM/Storage Configuration: 4GB+64GB / 4GB+128GB / 6GB+128GB / 8GB+256GB)
- Full 5G Dev Kit Package: 1× UIS7885 5G Core Board (8GB+128GB), 1× Interface Carrier Board, 4× 5G Cellular Antennas, 1× Wi-Fi/BT Antenna, 1× Active GNSS Antenna, 1× 12V/3A DC Power Adapter, 1× USB-C Debug Cable
Note: the dev kit contains an 8GB+128GB core board, a configuration that is not sold separately as a standalone variant.
5. Applications
- Smart Interactive Displays, Digital Signage & Intelligent Vending Terminals
- Industrial 5G Edge Gateways, Mobile Robotics (AMR / AGV) & Drone Compute Payloads
- AI Video Surveillance, Facial Recognition Access Control & Edge Analytics
- In-Vehicle Telematics, Smart Helmets, Handheld Rugged Tablets & Law Enforcement Recorders
6. Specification
Property SoC — Unisoc UIS7885 (P7885) ✅ Module — Jieyuan SoM ⚠️Process6nm EUVsame SoC CPU1× A76 @2.7 GHz + 3× A76 @2.3 GHz + 4× A55 @2.1 GHzsame SoC GPU4-core @850 MHz (official wording: NATT-4core; T820 datasheet: Mali-G57 MC4)same SoC NPU8 TOPS (INT8 + FP32) + VDSP VQ7 @1 GHzsame SoC MemoryLPDDR4X @2133 MHz; UFS 3.1 / eMMC 5.14+64 / 4+128 / 6+128 / 8+256 GB Modem5G NSA/SA, 2CC, SUL; LTE DL Cat15 + UL Cat18band list to be confirmed Video4K60 10-bit decode (H.264/H.265/VP9); 4K60 encode (H.264/H.265)same SoC Camera108M 4in1 / 64M ZSL; 4× MIPI CSI 4-lane4× CSI brought out (confirm) DisplayDP1.4 4K60; 2×4-lane DSI, max FHD+@120DP over USB-C + 2× DSI (confirm) ExpansionPCIe 3.0 ×1; USB 2.0 / 3.1 Gen2 / 3.0 OTG; SDIO 3.0 ×3; UART ×8; I2C ×10; SPI ×4; I2S ×6subset per module pinout — confirm WirelessWi-Fi 6 + BT 5.4 (UMW2663) or Wi-Fi 5 + BT 5.0 (UMW2651/2652)one of the two — confirm SecurityiSE financial-grade, SCA Level-2same SoC Power—3.55–4.4 V DC, typ 4.0 V (confirm) Dimensions—LGA 42.5 × 56.5 × 2.95 mm, ~17.5 g (confirm) Temperaturenot published at module levelclaimed −35 °C ~ +75 °C (confirm)
7. Detailed Descriptions & Resources
Platform: based on the Unisoc UIS7885 (P7885) platform — see Unisoc's official specifications for chip-level capabilities.
Hardware design support: module pinout definition, carrier-board schematic reference and RF antenna routing guidelines — available on request (datasheet package).
Software: Android 13 BSP source, Linux kernel drivers, camera ISP tuning profiles and AI model conversion tools — supplied with the module.
