TB-RK3399ProX NPU 3.0TOPS RockChip RK3399Pro AI Artificial Intelligence Development Board Supports Android/Linux
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TB-RK3399ProX artificial intelligence development board
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Equipped with a high-performance AI processing chip RK3399Pro and an integrated neural network processor NPU, the computing power is as high as 3.0Tops.
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It adopts the combination of core board and backplane, and is flexibly used in various embedded artificial intelligence fields.

Smaller size and strong compatibility
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The size is only 69.6mm×70mm, which meets the space requirements of small terminal products.
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SO-DIMM 260P standard gold finger interface to meet various signal requirements.

Support multiple operating systems: Android, Debian

Combination of core board + backplane to form a complete industrial application motherboard
Product Interface Information
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Core board specifications |
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SOC |
Rockchip RK3399Pro |
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CPU |
Dual-core Cortex-A72 up to 1.8GHz |
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Quad-core Cortex-A53 up to 1.4GHz |
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GPU |
ARM Mali-T860 MP4 Quad-core GPU |
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Support OpenGL ES1.1/2.0/3.0/3.1, OpenVG1.1, OpenCL, DX11 |
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Support AFBC(framebuffer compression) |
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NPU |
Support 8bit/16bit operation,Support TensorFlow、Caffe model,Computing performance up to 3.0TOPS |
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VPU |
Support 4K VP9 and 4K 10bits H265/H264 video decoding,reach up to 60fps |
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1080P multi-format video decoding (WMV, MPEG-1/2/4, VP8) |
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1080P video encoding, supports H.264, VP8 format |
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Video post processor: de-interlacing, denoising, edge/detail/color optimization |
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CPU Memory |
2GB/4GB LPDRR4 |
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NPU Memory |
1GB DRR3 |
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Storage flash |
16GB/32GB eMMC for CPU |
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input power |
DC 12V/2A |
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OS |
Android、Linux |
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Core board size |
69.6mm×70mm |
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PCB Specifications |
10-layer board, thickness 1.2mm |
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Interface Type |
SODIMM-260Pin |
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Baseplate Specifications |
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display interface |
1ch HDMI2.0(Type-A) interface, support 4K/60fps output 1 channel DP1.2 (Type-A) interface, supports 4K@60fps output 1 MIPI interface, supports 1920*1080@60fps output 1 channel eDP1.3 interface, support 2K@60fps output |
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audio port |
1 channel HDMI audio output 1 channel Speaker, speaker output 1 headphone output 1 microphone, onboard audio input |
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Ethernet |
10/100/1000Mbps Ethernet, RJ45 interface |
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Wireless network |
Supports 5G/2.4G dual-band wifi, BT4.2 |
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camera interface |
2-way MIPI-CSI camera interface (CPU side supports up to 13Mpixel, NPU side supports up to 2Mpixel) |
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USB |
2x USB2.0 Host, Type-A (CPU side) 1x USB3.0 OTG, Type-C (CPU side) |
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PCIe |
1-way PCIe x4 standard interface, supports expansion based on PCIe high-speed WIFI, storage, and other devices |
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button |
1x Recovery button; 1x Reset button; 1x Power button; |
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debugging |
1channel debugging serial port (Micro USB interface) |
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serial port |
1-way UART interface |
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Extension ports |
The 40Pin expansion interface includes:
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TB-RK3399ProX AI Development Board – High-Performance Edge AI Computing The TB-RK3399ProX is a compact, industrial-grade AI development board powered by Rockchip's RK3399Pro processor and integrated 3.0TOPS NPU. Designed for edge AI applications, it combines high-performance computing with flexible deployment across Android and Linux environments. Key Features: High-Performance AI Processing: RK3399Pro SoC with dual-core Cortex-A72 (1.8GHz) and quad-core Cortex-A53 (1.4GHz), paired with a dedicated 3.0TOPS neural network processor supporting 8-bit and 16-bit operations. Compatible with TensorFlow and Caffe models. Compact Form Factor: Measuring just 69.6mm × 70mm with SO-DIMM 260P gold-finger interface, the core board fits space-constrained embedded systems while maintaining full signal compatibility. Rich Multimedia Support: ARM Mali-T860 MP4 GPU with OpenGL ES, OpenVG, and OpenCL support. 4K VP9 and H.265/H.264 video decoding at 60fps; 1080P multi-format encoding. Flexible I/O Connectivity: Dual HDMI 2.0 and DisplayPort 1.2 (4K@60fps), dual MIPI-CSI camera interfaces, PCIe x4 expansion, dual USB 3.0, Gigabit Ethernet, and dual-band WiFi 5G/2.4G with Bluetooth 4.2. Modular Architecture: Core board + backplane design enables rapid prototyping and scalable industrial deployment. Memory & Storage: 2GB/4GB LPDDR4 CPU memory, 1GB DDR3 NPU memory, 16GB/32GB eMMC storage. Multi-OS Support: Pre-configured for Android and Debian Linux with comprehensive development documentation. Ideal for computer vision, edge inference, robotics, IoT gateways, and AI-powered embedded systems requiring low-latency processing.
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